1、Features：RoHS Compliant Halogen Free faster tripping,1812 Dimension,Surface mountable,Solid state Operation Current:0.10A3.50A Maximum Voltage:6V60Vdc Operating Temperature：-40 TO 85 Product Dimensions Pig.1 Unit：mm Terminal pad materials:Tin-Plated Nickle-copper Terminal pad solderability:Meets EIA
2、 specification RS 186-9E and ANSI/J-STD-002 Category 3.Positive Thermal Coefficent Diodes LP-MSM075/33Rev: 01.06.20181/5Model No.A B C D E Min Max Min Max Min Max Min Min 4.37 4.73 3.07 3.41 0.50 1.20 0.30 0.15 Thermal Derating Chart-IH（A）Part number Maximum ambient operating temperatures（）-40-20 0
3、25 40 5060 70 85 1.100.990.870.750.630.570.490.450.35Electrical CharacteristicModel No.Umax(Vdc)Imax(A)Ihold 25C(A)Itrip 25C(A)Time to trip R25 Current Time Rimin R1max(A)(Sec)()()24 100 0.75 1.50 8.0 0.20 0.090 0.450 LP-MSM075/33LP-MSM075/33LP-MSM075/33 Test Test Conditions Accept/Reject Criteria R
4、esistance In still air 25 RminRRmax Time to Trip Specified current，Vmax，25 Tmaximum Time to Trip Hold Current 30min，at IH No trip Trip Cycle Life Vmax，Imax，100cycles No arcing or burning Trip Endurance Vmax，1 hours No arcing or burning Physical Characteristics and Environmental Specifications Physic
5、al Characteristics Terminal materials:Tin-Plated Nickle-copper Soldering zone Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.Environmental Specifications Test Conditions Resistance Change Passive aging 85,1000hours 10%Humidity aging 85/85%RH.1000 hours 5%Thermal shock MIL-STD-202,Me
6、thod 107G +85/-40,20times-30%typical resistance change Solvent Resistance MIL-STD-202,Method 215 no change Vibration ML-STD-883C,Test Condition A No chage Electrical Specifications:Ihold=Hold Current.Maximum current device will not trip in 25 C still air.Itrip=Trip Current.Minimum current at which t
7、he device will always trip in 25 C still air.Vmax=Maximum operating voltage device can withstand without damage at rated current(Imax).Imax=Maximum fault current device can withstand without damage at rated voltage(Vmax).Pd=Maximum power dissipation when device is in the tripped state in 25 C still
8、air environment at rated voltage.Rimin/max=Minimum/Maximum device resistance prior to tripping at 25 C.R1max=Maximum device resistance is measured one hour post reflow.Test Procedures And Requirements Rev: 01.06.20182/5LP-MSM075/33 Solder reflow conditions Recommended reflow methods:IR,vapor phase o
9、ven,hot air oven,N2 environment for lead-free.Devices are not designed to be wave soldered to the bottom side of the board.Recommended maximum paste thickness is 0.25mm(0.010inch).Devices can be cleaned using standard industry methods and solvents.Soldering temprature profile meets RoHs leadfree pro
10、cess.Notes:If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements Recommended pad layout(mm)Rev: 01.06.20183/5LP-MSM075/33Tape Specification And Reel Dimensions Coverning Specifications EIA 481-1(Unit:mm)W 12.00+0.30/-0 P0 8.0 0.10 P1 4.0 0.10 P2 2.0
11、0.10 A0 3.50 0.10 B0 4.90 0.10 D0 1.50+0.10/-0 F 5.50 0.05 E1 1.75 0.10 T 0.30 0.10 Leader min.390 Trailer min.160 Reel Dimensions A 1781.0 N 591 W1 8.5+1.0/-0.2 W2 12.01 Rev: 01.06.20184/5Tape Specification And Reel Dimensions LP-MSM075/33The maximum ambient temperature shall not exceed 38.Storage
12、temperatures higher than 38 could result in the deformation of packaging materials.The maximum relative humidity recommended for storage is 60%.High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components.Sea
13、led plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use.The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present Warning Use PPTC beyond the maximum ratings or improper use may resul
14、t in device damage and possible electrical arcing and flame.PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.Device performance can be impacted negative
15、ly if devices are handled in a manner inconsistent with recommended electronic,thermal,and mechanical procedures for electronic components.Use PPTC with a large inductance in circuit will generate a circuit voltage(L di/dt)above the rated voltage of the PPTC.Avoid impact PPTC device its thermal expa
16、nsion like placed under pressure or installed in limited space.Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods.Requests that customers comply with our recommended solder pad layouts and recommended reflow profile.Improper board layouts or reflow profilecould negatively impact solderability performance of our devices.Storage Shanghai Leiditech Electronic Co.,Ltd Email: Tel:+86-021 50828806 Fax:+86-021 50477059Rev: 01.06.20185/5LP-MSM075/33
