1、Introduction toElectromagneticCompatibilitySecond EditionCLAYTON R. PAULDepartment of Electrical and Computer Engineering, School of Engineering,Mercer University, Macon, Georgia and Emeritus Professor of ElectricalEngineering, University of Kentucky, Lexington, KentuckyA JOHN WILEY & SONS, INC. PUB
2、LICATIONIntroduction toElectromagneticCompatibilitySecond EditionIntroduction toElectromagneticCompatibilitySecond EditionCLAYTON R. PAULDepartment of Electrical and Computer Engineering, School of Engineering,Mercer University, Macon, Georgia and Emeritus Professor of ElectricalEngineering, Univers
3、ity of Kentucky, Lexington, KentuckyA JOHN WILEY & SONS, INC. PUBLICATIONThis book is printed on acid-free paper. ?1Copyright # 2006 by John Wiley & Sons, Inc. All rights reserved.Published by John Wiley & Sons, Inc., Hoboken, New Jersey.Published simultaneously in Canada.No part of this publication
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10、Library of Congress Cataloging-in-Publication Data:Paul, Clayton R.Introduction to electromagnetic compatibility / Clayton R. Paul.-2nd ed.p. cm.“Wiley-Interscience.”Includes bibliographical references and index.ISBN-13: 978-0-471-75500-5 (alk. paper)ISBN-10: 0-471-75500-1 (alk. paper)1. Electromagn
11、etic compatibility. 2. Electronic circuits-Noise. 3. Digital electronics. 4.Shielding (Electricity) I. Title.TK7867.2.P38 2006621.382024-dc222005049400Printed in the United States of America10987654321This textbook is dedicated toThe humane and compassionate treatment of animals“For every difficult
12、problem there is always a simple answer and most of themare wrong.”“When you can measure what you are speaking about and express it in numbersyou know something about it; but when you cannot measure it, when you cannotexpress it in numbers your knowledge is of meagre and unsatisfactory kind; it mayb
13、e the beginning of knowledge but you have scarcely progressed in your thoughtsto the stage of science whatever the matter may be.”Lord KelvinContentsContentsPrefacexvii1Introduction to Electromagnetic Compatibility (EMC)11.1Aspects of EMC31.2History of EMC101.3Examples121.4Electrical Dimensions and
14、Waves141.5Decibels and Common EMC Units231.5.1Power Loss in Cables321.5.2Signal Source Specification37Problems43References482EMC Requirements for Electronic Systems492.1Governmental Requirements502.1.1Requirements for Commercial Products Marketedin the United States502.1.2Requirements for Commercial
15、 Products Marketedoutside the United States552.1.3Requirements for Military Products Marketed in theUnited States602.1.4Measurement of Emissions for Verification of Compliance622.1.4.1Radiated Emissions642.1.4.2Conducted Emissions672.1.5Typical Product Emissions722.1.6A Simple Example to Illustrate
16、the Difficulty in Meetingthe Regulatory Limits78vii2.2Additional Product Requirements792.2.1Radiated Susceptibility (Immunity)812.2.2Conducted Susceptibility (Immunity)812.2.3Electrostatic Discharge (ESD)812.2.4Requirements for Commercial Aircraft822.2.5Requirements for Commercial Vehicles822.3Desig
17、n Constraints for Products822.4Advantages of EMC Design84Problems86References893Signal Spectrathe Relationship between the Time Domain andthe Frequency Domain913.1Periodic Signals913.1.1The Fourier Series Representation of Periodic Signals943.1.2Response of Linear Systems to Periodic Input Signals10
18、43.1.3Important Computational Techniques1113.2Spectra of Digital Waveforms1183.2.1The Spectrum of Trapezoidal (Clock) Waveforms1183.2.2Spectral Bounds for Trapezoidal Waveforms1223.2.2.1Effect of Rise/Falltime on Spectral Content1233.2.2.2Bandwidth of Digital Waveforms1323.2.2.3Effect of Repetition
19、Rate and Duty Cycle1363.2.2.4Effect of Ringing (Undershoot/Overshoot)1373.2.3Use of Spectral Bounds in Computing Bounds on theOutput Spectrum of a Linear System1403.3Spectrum Analyzers1423.3.1Basic Principles1423.3.2Peak versus Quasi-Peak versus Average1463.4Representation of Nonperiodic Waveforms14
20、83.4.1The Fourier Transform1483.4.2Response of Linear Systems to Nonperiodic Inputs1513.5Representation of Random (Data) Signals1513.6Use of SPICE (PSPICE) In Fourier Analysis155Problems167References1754Transmission Lines and Signal Integrity1774.1The Transmission-Line Equations1814.2The Per-Unit-Le
21、ngth Parameters1844.2.1Wire-Type Structures186viiiCONTENTS4.2.2Printed Circuit Board (PCB) Structures1994.3The Time-Domain Solution2044.3.1Graphical Solutions2044.3.2The SPICE Model2184.4High-Speed Digital Interconnects and Signal Integrity2254.4.1Effect of Terminations on the Line Waveforms2304.4.1
22、.1Effect of Capacitive Terminations2334.4.1.2Effect of Inductive Terminations2364.4.2Matching Schemes for Signal Integrity2384.4.3When Does the Line Not Matter, i.e., When is MatchingNot Required?2444.4.4Effects of Line Discontinuities2474.5Sinusoidal Excitation of the Line and the Phasor Solution26
23、04.5.1Voltage and Current as Functions of Position2614.5.2Power Flow2694.5.3Inclusion of Losses2704.5.4Effect of Losses on Signal Integrity2734.6Lumped-Circuit Approximate Models283Problems287References2975Nonideal Behavior of Components2995.1Wires3005.1.1Resistance and Internal Inductance of Wires3
24、045.1.2External Inductance and Capacitance of Parallel Wires3085.1.3Lumped Equivalent Circuits of Parallel Wires3095.2Printed Circuit Board (PCB) Lands3125.3Effect of Component Leads3155.4Resistors3175.5Capacitors3255.6Inductors3365.7Ferromagnetic MaterialsSaturation and Frequency Response3405.8Ferr
25、ite Beads3435.9Common-Mode Chokes3465.10Electromechanical Devices3525.10.1DC Motors3525.10.2Stepper Motors3555.10.3AC Motors3555.10.4Solenoids3565.11Digital Circuit Devices3575.12Effect of Component Variability3585.13Mechanical Switches3595.13.1Arcing at Switch Contacts360CONTENTSix5.13.2The Showeri
26、ng Arc3635.13.3Arc Suppression364Problems369References3756Conducted Emissions and Susceptibility3776.1Measurement of Conducted Emissions3786.1.1The Line Impedance Stabilization Network (LISN)3796.1.2Common- and Differential-Mode Currents Again3816.2Power Supply Filters3856.2.1Basic Properties of Fil
27、ters3856.2.2A Generic Power Supply Filter Topology3886.2.3Effect of Filter Elements on Common- andDifferential-Mode Currents3906.2.4Separation of Conducted Emissions into Common-and Differential-Mode Components forDiagnostic Purposes3966.3Power Supplies4016.3.1Linear Power Supplies4056.3.2Switched-M
28、ode Power Supplies (SMPS)4066.3.3Effect of Power Supply Components on ConductedEmissions4096.4Power Supply and Filter Placement4146.5Conducted Susceptibility416Problems416References4197Antennas4217.1Elemental Dipole Antennas4217.1.1The Electric (Hertzian) Dipole4227.1.2The Magnetic Dipole (Loop)4267
29、.2The Half-Wave Dipole and Quarter-Wave Monopole Antennas4297.3Antenna Arrays4407.4Characterization of Antennas4487.4.1Directivity and Gain4487.4.2Effective Aperture4547.4.3Antenna Factor4567.4.4Effects of Balancing and Baluns4607.4.5Impedance Matching and the Use of Pads4637.5The Friis Transmission
30、 Equation4667.6Effects of Reflections4707.6.1The Method of Images470 xCONTENTS7.6.2Normal Incidence of Uniform Plane Waves on Plane,Material Boundaries4707.6.3Multipath Effects4797.7Broadband Measurment Antennas4867.7.1The Biconical Antenna4877.7.2The Log-Periodic Antenna490Problems494References5018
31、Radiated Emissions and Susceptibility5038.1Simple Emission Models for Wires and PCB Lands5048.1.1Differential-Mode versus Common-Mode Currents5048.1.2Differential-Mode Current Emission Model5098.1.3Common-Mode Current Emission Model5148.1.4Current Probes5188.1.5Experimental Results5238.2Simple Susce
32、ptibility Models for Wires and PCB Lands5338.2.1Experimental Results5448.2.2Shielded Cables and Surface Transfer Impedance546Problems550References5569Crosstalk5599.1Three-Conductor Transmission Lines and Crosstalk5609.2The Transmission-Line Equations for Lossless Lines5649.3The Per-Unit-Length Param
33、eters5679.3.1Homogeneous versus Inhomogeneous Media5689.3.2Wide-Separation Approximations for Wires5709.3.3Numerical Methods for Other Structures5809.3.3.1Wires with Dielectric Insulations(Ribbon Cables)5869.3.3.2Rectangular Cross-Section Conductors(PCB Lands)5909.4The InductiveCapacitive Coupling A
34、pproximate Model5959.4.1Frequency-Domain Inductive-Capacitive CouplingModel5999.4.1.1Inclusion of Losses: Common-ImpedanceCoupling6019.4.1.2Experimental Results6049.4.2Time-Domain InductiveCapacitive Coupling Model6129.4.2.1Inclusion of Losses: Common-Impedance Coupling 6169.4.2.2Experimental Result
35、s617CONTENTSxi9.5Lumped-Circuit Approximate Models6249.6An Exact SPICE (PSPICE) Model for Lossless, Coupled Lines6249.6.1Computed versus Experimental Results for Wires6339.6.2Computed versus Experimental Results for PCBs6409.7Shielded Wires6479.7.1Per-Unit-Length Parameters6489.7.2Inductive and Capa
36、citive Coupling6519.7.3Effect of Shield Grounding6589.7.4Effect of Pigtails6679.7.5Effects of Multiple Shields6699.7.6MTL Model Predictions6759.8Twisted Wires6779.8.1Per-Unit-Length Parameters6819.8.2Inductive and Capacitive Coupling6859.8.3Effects of Twist6899.8.4Effects of Balancing698Problems701R
37、eferences71010Shielding71310.1Shielding Effectiveness71810.2Shielding Effectiveness: Far-Field Sources72110.2.1Exact Solution72110.2.2Approximate Solution72510.2.2.1Reflection Loss72510.2.2.2Absorption Loss72810.2.2.3Multiple-Reflection Loss72910.2.2.4Total Loss73110.3Shielding Effectiveness: Near-F
38、ield Sources73510.3.1Near Field versus Far Field73610.3.2Electric Sources74010.3.3Magnetic Sources74010.4Low-Frequency, Magnetic Field Shielding74210.5Effect of Apertures745Problems750References75111System Design for EMC75311.1Changing the Way We Think about Electrical Phenomena75811.1.1Nonideal Beh
39、avior of Components and theHidden Schematic75811.1.2“Electrons Do Not Read Schematics”763xiiCONTENTS11.1.3What Do We Mean by the Term “Shielding”?76611.2What Do We Mean by the Term “Ground”?76811.2.1Safety Ground77111.2.2Signal Ground77411.2.3Ground Bounce and Partial Inductance77511.2.3.1Partial In
40、ductance of Wires78111.2.3.2Partial Inductance of PCB Lands78611.2.4Currents Return to Their Source on the Paths of LowestImpedance78711.2.5Utilizing Mutual Inductance and Image Planes to ForceCurrents to Return on a Desired Path79311.2.6Single-Point Grounding, Multipoint Grounding, andHybrid Ground
41、ing79611.2.7Ground Loops and Subsystem Decoupling80211.3Printed Circuit Board (PCB) Design80511.3.1Component Selection80511.3.2Component Speed and Placement80611.3.3Cable I/O Placement and Filtering80811.3.4The Important Ground Grid81011.3.5Power Distribution and Decoupling Capacitors81211.3.6Reduct
42、ion of Loop Areas82211.3.7Mixed-Signal PCB Partitioning82311.4System Configuration and Design82711.4.1System Enclosures82711.4.2Power Line Filter Placement82811.4.3Interconnection and Number of PrintedCircuit Boards82911.4.4Internal Cable Routing and Connector Placement83111.4.5PCB and Subsystem Pla
43、cement83211.4.6PCB and Subsystem Decoupling83211.4.7Motor Noise Suppression83211.4.8Electrostatic Discharge (ESD)83411.5Diagnostic Tools84711.5.1The Concept of Dominant Effect in the Diagnosis ofEMC Problems850Problem856References857Appendix AThe Phasor Solution Method859A.1Solving Differential Equa
44、tions for Their Sinusoidal,Steady-State Solution859CONTENTSxiiiA.2Solving Electric Circuits for Their Sinusoidal,Steady-State Response863Problems867References869Appendix BThe Electromagnetic Field Equations and Waves871B.1Vector Analysis872B.2Maxwells Equations881B.2.1Faradays Law881B.2.2Amperes Law
45、892B.2.3Gauss Laws898B.2.4Conservation of Charge900B.2.5Constitutive Parameters of the Medium900B.3Boundary Conditions902B.4Sinusoidal Steady State907B.5Power Flow909B.6Uniform Plane Waves909B.6.1Lossless Media912B.6.2Lossy Media918B.6.3Power Flow922B.6.4Conductors versus Dielectrics923B.6.5Skin Dep
46、th925B.7Static (DC) Electromagnetic Field Relationsa Special Case927B.7.1Maxwells Equations for Static (DC) Fields927B.7.1.1Range of Applicability forLow-Frequency Fields928B.7.2Two-Dimensional Fields and LaplacesEquation928Problems930References939Appendix CComputer Codes for Calculating the Per-Uni
47、t-Length(PUL) Parameters and Crosstalk of MulticonductorTransmission Lines941C.1WIDESEP.FOR for Computing the PULParameter Matrices of Widely Spaced Wires942C.2RIBBON.FOR for Computing the PUL ParameterMatrices of Ribbon Cables947C.3PCB.FOR for Computing the PUL ParameterMatrices of Printed Circuit
48、Boards949xivCONTENTSC.4MSTRP.FOR for Computing the PUL ParameterMatrices of Coupled Microstrip Lines951C.5STRPLINE.FOR for Computing the PULParameter Matrices of Coupled Striplines952C.6SPICEMTL.FOR for Computing a SPICE(PSPICE) Subcircuit Model of a Lossless,Multiconductor Transmission Line954C.7SP
49、ICELPI.FOR For Computing a SPICE (PSPICE)Subcircuit of a Lumped-Pi Model of a Lossless,Multiconductor Transmission Line956Appendix DA SPICE (PSPICE) Tutorial959D.1Creating the SPICE or PSPICE Program960D.2Circuit Description961D.3Execution Statements966D.4Output Statements968D.5Examples970References
50、974Index975CONTENTSxvPREFACEPrefaceThis is the second edition of a textbook that was originally published in 1992 and isintended for a university/college course in electromagnetic compatibility (EMC). Ithas also proved to be very beneficial as a reference for industrial professionalsinterested in EM
