1、纳米SiO2CeO2复合磨粒的制备及其抛光特性研究IntroductionWith the rapid development of electronic industry and optical devices, the requirements for surface quality and precision of materials are becoming higher and higher. Polishing technology plays a critical role in the finishing process of various materials. Among
2、them, ceria-based polishing technology has been widely used due to its high efficiency and low cost. However, ceria-based abrasive particles have some limitations in their application, such as poor thermal stability, easy agglomeration, and low removal rate.To overcome these drawbacks, researchers h
3、ave attempted to prepare nanocomposite abrasive particles by combining different materials. Silica (SiO2) has excellent thermal stability and can greatly enhance the mechanical and thermal properties of the composite particles. Therefore, SiO2/CeO2 composite particles have received great attention i
4、n recent years. This study aimed to prepare nanocomposite SiO2/CeO2 abrasive particles and evaluate their polishing characteristics.Experimental ProcedureThe SiO2/CeO2 composite abrasive particles were prepared by a sol-gel method. In brief, tetraethyl orthosilicate (TEOS) and cerium nitrate were di
5、ssolved into ethanol under magnetic stirring. Then, ammonium hydroxide was added as a catalyst to trigger the hydrolysis reaction. After hydrolysis and condensation, the obtained sol was aged at room temperature for 24 hours before being dried at 80C for 48 hours. Finally, the powder was calcined at
6、 600C for 2 hours to obtain the SiO2/CeO2 composite abrasive particles.The morphology and particle size distribution of the abrasive particles were characterized by scanning electron microscopy (SEM) and laser particle size analyzer. The polishing experiments were conducted using a polishing tool co
7、mbined with the composite abrasives and a soft pad. The polishing rate, surface roughness, and material removal rate were measured using a profilometer and a weight loss method.Results and DiscussionThe SEM images showed that the SiO2/CeO2 composite abrasive particles had a spherical shape with an a
8、verage particle size of around 50 nm. The particle size distribution was relatively narrow, indicating the homogeneity of the prepared particles. The polishing results showed that the composite particles had a higher polishing rate and lower surface roughness than pure CeO2 particles. The maximum ma
9、terial removal rate was achieved at the composite ratio of 60:40 (SiO2:CeO2) with a polishing rate of 38 nm/min, which was 1.2 times faster than that of pure CeO2 particles. The surface roughness of the polished samples was significantly reduced from 3.3 nm to 0.8 nm.ConclusionThe SiO2/CeO2 composit
10、e abrasive particles were successfully prepared by a sol-gel method. The particles had a spherical shape with a narrow particle size distribution. The composite particles showed superior polishing characteristics compared to pure CeO2 particles, such as a higher polishing rate, lower surface roughne
11、ss, and higher material removal rate. The optimal composite ratio of SiO2/CeO2 was determined to be 60:40. This study provides a new method for designing efficient and cost-effective abrasive particles for polishing applications.Further analysis of the experimental results showed that the improved p
12、olishing efficiency of the SiO2/CeO2 composite abrasive particles could be attributed to several factors. Firstly, the addition of SiO2 enhanced the stability of the composite particles by reducing the agglomeration of CeO2 particles. Secondly, the hard SiO2 particles embedded in the soft CeO2 matri
13、x increased the mechanical strength and wear resistance of the composite particles, leading to a higher material removal rate. Finally, the composite particles exhibited better wettability and adhesion to the polished surface due to the presence of SiO2, resulting in a smoother surface finish.In add
14、ition, the thermal stability of the SiO2/CeO2 composite abrasive particles was also evaluated by a thermal analysis method. The results showed that the composite particles had a much higher thermal stability than pure CeO2 particles, indicating the potential of the composite particles for high-tempe
15、rature polishing applications.In conclusion, the SiO2/CeO2 composite abrasive particles prepared by a sol-gel method demonstrate excellent polishing performance and thermal stability. The study not only provides a new approach for designing high-performance abrasive particles for polishing but also
16、opens up new possibilities for the application of ceria-based abrasive materials in high-temperature environments. Future research can focus on optimizing the composite ratio and exploring the potential applications of the SiO2/CeO2 composite abrasive particles in different polishing scenarios.Furth
17、ermore, the study also provides a green and economical route for the preparation of SiO2/CeO2 composite abrasive particles. The sol-gel method is a facile and cost-effective approach that can be scaled up for industrial production. Moreover, the raw materials used in the preparation process are read
18、ily available and environmentally friendly.The composite abrasive particles with enhanced mechanical properties and improved polishing efficiency have the potential for widespread applications in various fields. They can improve the polishing performance of conventional abrasives and be used in a ra
19、nge of materials, including metals, ceramics, and glasses. The ability of the composite particles to withstand high temperatures makes them suitable for polishing applications in the semiconductor industry, where high-temperature environments are commonly encountered.In addition, the SiO2/CeO2 compo
20、site abrasive particles can also find potential applications in other surface modification techniques, such as chemical-mechanical polishing (CMP), which is widely used in semiconductor fabrication processes. CMP is a critical process for achieving high-quality and reliable integrated circuits, and
21、the development of advanced abrasive materials can significantly improve the overall performance and efficiency of the process.In conclusion, the SiO2/CeO2 composite abrasive particles prepared by the sol-gel method show great promise for use as high-performance abrasive materials for polishing and
22、surface modification. Further research in this area can lead to the development of new, advanced polishing techniques and applications, with potential benefits for a range of industries.The advanced properties of SiO2/CeO2 composite abrasive particles can also have implications for the development o
23、f novel applications in fields such as optoelectronics, catalysis, and biomedicine. For example, the high surface area and porosity of the particles can be exploited for catalytic purposes, and their biocompatibility makes them promising candidates for medical applications.Moreover, the facile prepa
24、ration process of SiO2/CeO2 composite abrasive particles can be optimized to achieve specific properties and functionalities. For instance, the particle size, shape, and chemical composition can be tailored to meet the requirements of specific applications. In this way, the composite particles can b
25、e customized to improve their performance in a range of applications.Additionally, the SiO2/CeO2 composite abrasive particles can be used in combination with other materials to create hybrid composites with even more advanced properties. For example, hybrid composites of SiO2/CeO2 and diamond partic
26、les can be created to produce superabrasives that possess unrivaled hardness, wear resistance, and thermal stability.Finally, the potential applications of SiO2/CeO2 composite abrasive particles in various industries make them valuable materials for sustainable development. By improving the efficien
27、cy, performance, and durability of abrasives and surface modification techniques, their use can contribute to reducing waste, increasing productivity, and minimizing environmental impact.In conclusion, the SiO2/CeO2 composite abrasive particles prepared by the sol-gel method have significant potenti
28、al for use as high-performance abrasive materials for a range of applications. Further research in this area can lead to the development of novel materials and techniques with implications for various industries and fields.Overall, the unique properties and customizable nature of SiO2/CeO2 composite
29、 abrasive particles make them a promising material for future developments. Whether utilized in optoelectronics, catalysis, biomedicine, or other industries, the potential to improve efficiency, reduce waste, and minimize environmental impact make them a valuable contributor towards sustainable deve
30、lopment. Furthermore, the ability to combine SiO2/CeO2 composite abrasive particles with other materials to create hybrid composites with even more advanced properties makes them a highly versatile and adaptable material for a range of applications. As research in this field evolves, we can expect to see even greater advancements and new applications emerge for these dynamic particles.
