1、 Team LiB Table of ContentsSignal Integrity - SimplifiedBy Eric Bogatin Publisher: Prentice Hall PTRPub Date: September 15, 2003ISBN: 0-13-066946-6Pages: 608 Copyright Prentice Hall Modern Semiconductor Design Series About Prentice Hall Professional Technical Reference Preface Top Ten Signal Integri
2、ty Principles Chapter 1. Signal Integrity Is in Your Future Section 1.1. What Is Signal Integrity? Section 1.2. Signal Quality on a Single Net Section 1.3. Cross Talk Section 1.4. Rail-Collapse Noise Section 1.5. Electromagnetic Interference (EMI) Section 1.6. Two Important Signal Integrity Generali
3、zations Section 1.7. Trends in Electronic Products Section 1.8. The Need for a New Design Methodology Section 1.9. A New Product Design Methodology Section 1.10. Simulations Section 1.11. Modeling and Models Section 1.12. Creating Circuit Models from Calculation Section 1.13. Three Types of Measurem
4、ents Section 1.14. The Role of Measurements Section 1.15. The Bottom Line Chapter 2. Time and Frequency Domains Section 2.1. The Time Domain Section 2.2. Sine Waves in the Frequency Domain Section 2.3. Shorter Time to a Solution in the Frequency Domain Section 2.4. Sine Wave Features Section 2.5. Th
5、e Fourier Transform Section 2.6. The Spectrum of a Repetitive Signal Section 2.7. The Spectrum of an Ideal Square Wave Section 2.8. From the Frequency Domain to the Time Domain Section 2.9. Effect of Bandwidth on Rise Time Section 2.10. Bandwidth and Rise Time Section 2.11. What Does Significant Mea
6、n? Section 2.12. Bandwidth of Real Signals Section 2.13. Bandwidth and Clock Frequency Section 2.14. Bandwidth of a Measurement Section 2.15. Bandwidth of a Model Section 2.16. Bandwidth of an Interconnect Section 2.17. Bottom Line Chapter 3. Impedance and Electrical Models Section 3.1. Describing S
7、ignal-Integrity Solutions in Terms of Impedance Section 3.2. What Is Impedance? Section 3.3. Real vs. Ideal Circuit Elements Section 3.4. Impedance of an Ideal Resistor in the Time Domain Section 3.5. Impedance of an Ideal Capacitor in the Time Domain Section 3.6. Impedance of an Ideal Inductor in t
8、he Time Domain Section 3.7. Impedance in the Frequency Domain Section 3.8. Equivalent Electrical Circuit Models Section 3.9. Circuit Theory and SPICE Section 3.10. Introduction to Modeling Section 3.11. The Bottom Line Chapter 4. The Physical Basis of Resistance Section 4.1. Translating Physical Des
9、ign into Electrical Performance Section 4.2. The Only Good Approximation for the Resistance of Interconnects Section 4.3. Bulk Resistivity Section 4.4. Resistance per Length Section 4.5. Sheet Resistance Section 4.6. The Bottom Line Chapter 5. The Physical Basis of Capacitance Section 5.1. Current F
10、low in Capacitors Section 5.2. The Capacitance of a Sphere Section 5.3. Parallel Plate Approximation Section 5.4. Dielectric Constant Section 5.5. Power and Ground Planes and Decoupling Capacitance Section 5.6. Capacitance per Length Section 5.7. 2D Field Solvers Section 5.8. Effective Dielectric Co
11、nstant Section 5.9. The Bottom Line Chapter 6. The Physical Basis of Inductance Section 6.1. What Is Inductance? Section 6.2. Inductance Principle #1: There Are Circular Magnetic-Field Line Loops Around All Currents Section 6.3. Inductance Principle #2: Inductance Is the Number of Webers of Field Li
12、ne Loops Around a Conductor per Amp of Current Through It Section 6.4. Self-Inductance and Mutual Inductance Section 6.5. Inductance Principle #3: When the Number of Field Line Loops Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor Section 6.6. Partial Ind
13、uctance Section 6.7. Effective, Total, or Net Inductance and Ground Bounce Section 6.8. Loop Self- and Mutual Inductance Section 6.9. The Power-Distribution System (PDS) and Loop Inductance Section 6.10. Loop Inductance per Square of Planes Section 6.11. Loop Inductance of Planes and Via Contacts Se
14、ction 6.12. Loop Inductance of Planes with a Field of Clearance Holes Section 6.13. Loop Mutual Inductance Section 6.14. Equivalent Inductance Section 6.15. Summary of Inductance Section 6.16. Current Distributions and Skin Depth Section 6.17. High-Permeability Materials Section 6.18. Eddy Currents
15、Section 6.19. The Bottom Line Chapter 7. The Physical Basis of Transmission Lines Section 7.1. Forget the Word Ground Section 7.2. The Signal Section 7.3. Uniform Transmission Lines Section 7.4. The Speed of Electrons in Copper Section 7.5. The Speed of a Signal in a Transmission Line Section 7.6. S
16、patial Extent of the Leading Edge Section 7.7. Be the Signal Section 7.8. The Instantaneous Impedance of a Transmission Line Section 7.9. Characteristic Impedance and Controlled Impedance Section 7.10. Famous Characteristic Impedances Section 7.11. The Impedance of a Transmission Line Section 7.12.
17、Driving a Transmission Line Section 7.13. Return Paths Section 7.14. When Return Paths Switch Reference Planes Section 7.15. A First-Order Model of a Transmission Line Section 7.16. Calculating Characteristic Impedance with Approximations Section 7.17. Calculating the Characteristic Impedance with a
18、 2D Field Solver Section 7.18. An n-Section Lumped Circuit Model Section 7.19. Frequency Variation of the Characteristic Impedance Section 7.20. The Bottom Line Chapter 8. Transmission Lines and Reflections Section 8.1. Reflections at Impedance Changes Section 8.2. Why Are There Reflections? Section
19、 8.3. Reflections from Resistive Loads Section 8.4. Source Impedance Section 8.5. Bounce Diagrams Section 8.6. Simulating Reflected Waveforms Section 8.7. Measuring Reflections with a TDR Section 8.8. Transmission Lines and Unintentional Discontinuities Section 8.9. When to Terminate Section 8.10. T
20、he Most Common Termination Strategy for Point-to-Point Topology Section 8.11. Reflections from Short Series Transmission Lines Section 8.12. Reflections from Short-Stub Transmission Lines Section 8.13. Reflections from Capacitive End Terminations Section 8.14. Reflections from Capacitive Loads in th
21、e Middle of a Trace Section 8.15. Capacitive Delay Adders Section 8.16. Effects of Corners and Vias Section 8.17. Loaded Lines Section 8.18. Reflections from Inductive Discontinuities Section 8.19. Compensation Section 8.20. The Bottom Line Chapter 9. Lossy Lines, Rise-Time Degradation, and Material
22、 Properties Section 9.1. Why Worry About Lossy Lines Section 9.2. Losses in Transmission Lines Section 9.3. Sources of Loss: Conductor Resistance and Skin Depth Section 9.4. Sources of Loss: The Dielectric Section 9.5. Dissipation Factor Section 9.6. The Real Meaning of Dissipation Factor Section 9.
23、7. Modeling Lossy Transmission Lines Section 9.8. Characteristic Impedance of a Lossy Transmission Line Section 9.9. Signal Velocity in a Lossy Transmission Line Section 9.10. Attenuation and the dB Section 9.11. Attenuation in Lossy Lines Section 9.12. Measured Properties of a Lossy Line in the Fre
24、quency Domain Section 9.13. The Bandwidth of an Interconnect Section 9.14. Time-Domain Behavior of Lossy Lines Section 9.15. Improving the Eye Diagram of a Transmission Line Section 9.16. Pre-emphasis and Equalization Section 9.17. The Bottom Line Chapter 10. Cross Talk in Transmission Lines Section
25、 10.1. Superposition Section 10.2. Origin of Coupling: Capacitance and Inductance Section 10.3. Cross Talk in Transmission Lines: NEXT and FEXT Section 10.4. Describing Cross Talk Section 10.5. The SPICE Capacitance Matrix Section 10.6. The Maxwell Capacitance Matrix and 2D Field Solvers Section 10.
26、7. The Inductance Matrix Section 10.8. Cross Talk in Uniform Transmission Lines and Saturation Length Section 10.9. Capacitively Coupled Currents Section 10.10. Inductively Coupled Currents Section 10.11. Near-End Cross Talk Section 10.12. Far-End Cross Talk Section 10.13. Decreasing Far-End Cross T
27、alk Section 10.14. Simulating Cross Talk Section 10.15. Guard Traces Section 10.16. Cross Talk and Dielectric Constant Section 10.17. Cross Talk and Timing Section 10.18. Switching Noise Section 10.19. Summary of Reducing Cross Talk Section 10.20. The Bottom Line Chapter 11. Differential Pairs and D
28、ifferential Impedance Section 11.1. Differential Signaling Section 11.2. A Differential Pair Section 11.3. Differential Impedance with No Coupling Section 11.4. The Impact from Coupling Section 11.5. Calculating Differential Impedance Section 11.6. The Return-Current Distribution in a Differential P
29、air Section 11.7. Odd and Even Modes Section 11.8. Differential Impedance and Odd-Mode Impedance Section 11.9. Common Impedance and Even-Mode Impedance Section 11.10. Differential and Common Signals and Odd- and Even-Mode Voltage Components Section 11.11. Velocity of Each Mode and Far-End Cross Talk
30、 Section 11.12. Ideal Coupled Transmission-Line Model or an Ideal Differential Pair Section 11.13. Measuring Even- and Odd-Mode Impedance Section 11.14. Terminating Differential and Common Signals Section 11.15. Conversion of Differential to Common Signals Section 11.16. EMI and Common Signals Secti
31、on 11.17. Cross Talk in Differential Pairs Section 11.18. Crossing a Gap in the Return Path Section 11.19. To Tightly Couple or Not to Tightly Couple Section 11.20. Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements Section 11.21. The Characteristic Impedance Matrix Sect
32、ion 11.22. The Bottom Line Appendix A. 100 General Design Guidelines to Minimize Signal-Integrity Problems Section A.1. Minimize Signal-Quality Problems on One Net Section A.2. Minimize Cross Talk Section A.3. Minimize Rail Collapse Section A.4. Minimize EMI Appendix B. 100 Collected Rules of Thumb
33、to Help Estimate Signal-Integrity Effects Section B.1. Chapter 2 Section B.2. Chapter 3 Section B.3. Chapter 4 Section B.4. Chapter 5 Section B.5. Chapter 6 Section B.6. Chapter 7 Section B.7. Chapter 8 Section B.8. Chapter 9 Section B.9. Chapter 10 Section B.10. Chapter 11 Appendix C. Selected Refe
34、rences About the Author Team LiB Br o u g h t t o Yo u b yLi k e t h e b o o k ? Bu y i t ! Team LiB Table of ContentsSignal Integrity - SimplifiedBy Eric Bogatin Publisher: Prentice Hall PTRPub Date: September 15, 2003ISBN: 0-13-066946-6Pages: 608 Suitable for even non-specialists, Signal Integrity
35、Simplified offers a comprehensive, easy-to-follow look at how physical interconnects affect electrical performance. World-class engineer Eric Bogatin expertly reviews the root causes of the four families of signal integrity problems and offers solutions to design them out early in the design cycle.
36、Coverage includes: An introduction to signal integrity and physical design A fundamental understanding of what bandwidth, inductance, and characteristic impedance really mean Analysis of resistance, capacitance, inductance, and impedance The four important practical tools used to solve signal integr
37、ity problems: rules of thumb, analytic approximations, numerical simulation, and measurements The effect of the physical design of interconnects on signal integrity Solutions that do not hide behind mathematical derivations Recommendations for design guidelines to improve signal integrity, and much
38、more Unlike related books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Specially designed for everyone in the electronics industry, from electrical engineers to product managers, Signal I
39、ntegritySimplified will prove itself an invaluable resource for helping you find and fix signal integrity problems before they become problems. Team LiB Team LiB CopyrightLibrary of Congress Cataloging-in-Publication Data Bogatin, Eric. Signal integrity simplified / by Eric Bogatin. p. cm. (Prentice
40、 Hall modern semiconductor design series) ISBN 0-13-066946-6 1. Signal processingDigital techniques. 2. Impedance (Electricity) I. Title. II. Series. TK5102.9.B58 2003 621.3815dc21 2003049870Editorial/production supervision: BooksCraft, Inc.Cover design director: Jerry VottaCover designer: Name Need
41、edArt director: Gail Cocker-BoguszManufacturing buyer: Maura ZaldivarPublisher: Bernard GoodwinEditorial assistant: Michelle VincentiMarketing manager: Dan DePasqualeFull-service production manager: Anne R. Garcia 2004 by Pearson Education, Inc.Publishing as Prentice Hall Professional Technical Refe
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44、y be reproduced, in any form or by any means, without permission in writing from the publisher.Printed in the United States of America1st printingPearson Education LTD. Pearson Education Australia PTY, Limited Pearson Education Singapore, Pte. Ltd. Pearson Education North Asia Ltd. Pearson Education
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